Hikvision, the world’s leading supplier of innovative video surveillance products and solutions, exhibited the latest AI products and technologies at 2018 Security China. More than 1,000 organisations participated in the exhibition which attracted a diverse audience of global distributors, integrators, IT professionals, technology enthusiasts and consumers to join the conversations about solutions around AI, intelligent security, cloud and other mega trends.
At the show, Hikvision announced the release to the Chinese market of its AI Cloud framework including platforms for AI Applications, Resource Management, Operations and Maintenance Services. Hikvision is working closely with ecosystem partners on AI Cloud network infrastructure, platform services and application interfaces.
In the product area of the exhibition, Hikvision showed its latest, core technological breakthroughs and products including:
- A 3D camera with the capability of 3D face modeling, which can prevent spoofing attack of photos, video and masks, and improve the comparison of facial features and side face;
- A demo model of 64MP PanoVu camera that adopts integrated design, panoramic images by an eight-sensors patchwork to support 360 ° panoramic monitoring, as well as simultaneous panoramic and close-up pictures;
- A deep learning-based thermal imaging camera for effective fire detection and with algorithms for behavior analysis and accurate face temperature measurement.
In addition, Hikvision showcased its intelligent solutions for public security and commercial applications, like safe cities, intelligent transport systems (ITS) and smart retail with more than 20 scenario-specific intelligent solutions on display. One example was the ITS solution, which has the capability to analyze video feeds, learn traffic behavior and support management of traffic flow, congestion and incidents.
Visitors could also see a wide range of innovations and products for new Hikvision enterprises, such as smart home products (EZVIZ), industrial automation (Hik Robotics), Automotive Electronics and Intelligent Storage.